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Plasma Etching Processes for Interconnect Realization in VLSI
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A trade between discovery of BEOL and a precise understanding of the etch issues

Table of Contents

I. Introduction
II. Interaction Plasma / Dielectric
III. Porous SiOCH film integration
IV. Interconnects for tomorrow
V. References

About the Author

Nicolas Posseme is a Senior Research Scientist in MIcrotechnologie & Nanotechnology and Deputy Head of Plasma Etching & Stripping in the Silicon Technologies division at the CEA-LETI Laboratory in Grenoble, France.

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